Liquidus Temperature Design of Lead-Free Solder
نویسندگان
چکیده
منابع مشابه
Lead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
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With the recent rapid advances in medical technology there are a variety of intrusive procedures used in the medical industry today requiring tools, instruments, sensors and components in materials that are inert with respect to reactions with the body. More, new surgical techniques have been developed to improve the quality of operations, reduce the risk to patients and reduce the pain experie...
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There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as t...
متن کاملLead-free Solder Joint Quality Investigation
New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...
متن کاملMechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation
The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) CueSn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic...
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ژورنال
عنوان ژورنال: MATERIALS TRANSACTIONS
سال: 2006
ISSN: 1345-9678,1347-5320
DOI: 10.2320/matertrans.47.1082